DCB / DBC Substrate

DCB-Substrates (Direct Copper Bond) - or DBC-Substrates (Direct Bond Copper) of AL2O3 (Alumina) or AIN (Aluminium Nitrid) is a widely acceptable and a timeproven technology for power electronic products. The high thermal conducctivity, high current capacity and heat dissation of the high-purity copper on ceramic make the direct bond copper substrate (DBC) essential for electronoc power applications.

We have a short lead time for samples and high series demands.

Typical applications are power switches like IGBT and MOSFETS mostly use in power electronic, laser-applications, Solar Application and automotiv-applications like HYBRIDE CARS.

Advantage of Direct Bond Ceramic (DCB):

Very high temperature resistance and thermal cycling reliability
Outstandig heat conductivity. 24 W/mk Al2O3 und 180 W/mK AIN
High electrical isolation > 15 KV/mm
Low CTE (coefficient of thermal expansion) 6,8 ppm - AL2O3 und 4,0 ppm - AIN
Excellente metallization adhesion. Initial and after thermal cycling
Good mechanical strenght and stability
High current handling capacity, depending from copper thickness 0,12mm; 0,2mm; 0,3mm und 0,4mm

Our LVM (low volume manufacturing) DBC program will be available for orders that may not meet the minimum requirements for a normal production run with other manufactures. LVM orders may be limites to select material configuratiions and quantities.

Particularly for development departments, research companies and universities we help to start new appications on dcb-substrates.

Easy To Buy From mean after the receive of your DXF-File from the Top- and Bottom-layer you will receive our quotation quickly.

Overview Metallization

DBC Substrates for power applications you can order with different copper thickness and finish. Master Card Size: 190 mm x 139 mm / 7,5” x 5,5” Usable Cu Area: 177 mm x 127 mm / 7“ x 5“ Ceramic Tolerance: + 200 µm / - 50 µm Thickness Tolerance: Ceramic/Copper + 7% / -10% Surface Finish: Cu or Ni 2,5 µm typ., Au 0,05 µm – 0,7 µm Electroless Au metallization with 0,03 µm Pd between Ni and Au-layer Electroless Ag 0,15 µm – 0,45 µm thickness
Applicationen: Solderability is outstanding with Pb-Sn, Sn-Ag-Cu, Au-Sn and others Al-Wire bonding > Al-Wires from 75 µm- 500 µm thickness depending from finish Finish, see above Au-Wire bonding > Au-Wires from 17,5 µm – 50 µm dick depending from finish Finish, see above Operation Temeperature: - 55°C bis + 850°C
DBC Direct Bond Copper Substrates > Alumina with Copper Thickness AL2O3 diameter 0,127 mm 0,203 mm 0,304 mm 0,254 mm X X 0,381 mm X X X 0,635 mm X X X 1,016 mm X X X Copper Thickness above 0,3 mm on request	.
DBC Direct Bond Copper Substrates > Aluminium Nitrid - and Copper Thickness AIN diameter 0,127 mm 0,203 mm 0,304 mm 0,381 mm X X 0,635 mm X X X 1,016 mm X X X Copper Thickness above 0,3 mm on request
Line & Spaces Copper Thickness Line Space Pitch 0,127 mm nominal 0,3 mm 0,3 mm 0,6 mm 0,127 mm minimum 0,254 mm 0,254 mm 0,508 mm 0,203 mm nominal 0,508 mm 0,508 mm 1,016 mm 0,203 mm minimum 0,406 mm 0,406 mm 0,816 mm 0,254 mm nominal 0,711 mm 0,711 mm 1,440 mm 0,254 mm minimum 0,508 mm 0,508 mm 1,016 mm 0,304 mm nominal 0,711 mm 0,711 mm 1,440 mm 0,304 mm minimum 0,508 mm 0,508 mm 1,016 mm
Cu Etching Tolerances Copper Thickness Line Space 0,127 mm +/- 0,127 mm +/- 0,100 mm 0,203 mm +/- 0,152 mm +/- 0,100 mm 0,254 mm +/- 0,203 mm +/- 0,152 mm 0,304 mm +/- 0,203 mm +/- 0,152 mm Please do not hesitate to call or send an email in case of questions

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