PCB and DBC Surface Finish

Electroless nickel / palladium / gold (Sudpalladium, ENIPIG)

Application: Gold (Au) and Aluminium (Al) wire bonding and soldering

• Process: Nickel/Palladium/Gold
  
• Panel size max: 630 mm x650 mm
  Panel thickness: 0,5 mm bis 4,5 mm
  
• Nickel layer thickness: Ni 4 µm - 8 µm
• Palladium thickness: Pd 0,01 µm - 0,04 µm
• Sud Gold thickness: Sud-Au 0,03 µ - 0,08 µm
  

Electroless nickel / gold (immersion gold, ENIG)

Application: Aluminium (Al) Wire bonding and soldering

• Process: Electroless nickel / gold (immersion Gold)
  
  
• Panel Size: 630 mm x 550 mm
  Panel thickness: 0,5 mm - 4,5 mm
  
  
• Nickel layer thickness: Ni 4 µm - 8 µm
  
• Immersion gold layer thickness: 0,05 µm - 0,1 µm

Immersion tin

Outstanding soldering, refreshable

• Process: Chemical Tin (Sn)
  
  
• Panel size max: 630 mm, min size 100 mm x 60 mm
  Panel thickness: 0,1 mm - 4,0 mm
  
  
• Tin layer thickness: Sn 1 µm - 1,2 µm
  

Immersion silver

Outstanding solderable, refreshable

• Process: Chemical Silver (Ag)
  
  
• Panel size max: 630 mm breit, min. size 100 mm x 60 mm
  Panel thickness: 0,1 mm - 4,0 mm
  
  
• Silver (Ag) thickness 0,15 µm - 0,45 µm

OSP / Glicoat-SMDF2 (LX)

Low cost coating, Refreshable

• Process: OSP / Glicoat-SMDF2 (LX)
  
  
• Panel size max: 630 mm, min. size100 mm x 60 mm
  Dicke: 0,1 mm - 5,0 mm
  
  
• OSP layer thickness: 0,15 µm - 0,3 µm

Electroplating nickel / gold (hard gold)

Optimum hardness for connerctors (cobalt allyed), plug contacts
Decorative coating

• Process: Electroplated nickel / Gold (Hard gold)
  Cobald legiert
  
  
• Panel size max: 610 mm - 550 mm
  Panel thickness: 0,5 mm - 3,0 mm
  
  
• Layer thickness: Ni > 5 µm / Hard gold thickness 0,2 µm - 2 µm