Metal Matrix Composites
Metal-Diamond composites such as aluminium-diamond, copper-diamond or silver-diamond are composite materials which allow to combine a high thermal conductivity (range from 300 to 650 W/mK) with a tailored (significantly reduced) coefficient of thermal expansion (between 6 to 12 ppm/K). These materials are of interest for applications as heat sinks, heat spreaders, heat slugs or base plates to provide a reliable and sufficient cooling.
We offers Metal-Diamond composites with properties tailored in a certain range. Aluminium-Diamond, Copper-Diamond and Silver-Diamond MMCs.
Metal-Diamond plates can be produced in various size between 10mm x 10mm to 150mm x 150mm with thickness typically ranging from 2 – 20 mm. Due to the use of sandwich technology Hot Pressing technology is able to provide plates with a high surface quality.
By using hot pressing technology to prepare these type of materials, it is possible to realize sandwich structures or even parts with a certain complexity. Examples for applications of this type of materials are given in several areas of micro, power- or optoelectronic devices such as: Heat spreaders or lids for CPUs in high performance computing or server applications; Cooling plates for LED or laser diodes; Base plate for high power module (IGBT)
DiaCool - Metal-Diamond Composites is a high Performance Materials for ElectronicCooling
Metal - Diamond Composites combine a high thermal conductivity with a low Coefficient of Thermal Expansion (CTE). Such materials are of interest for applications in electronic industry as:
Properties of Metal - Diamond Composites:
|Range of properties||Aluminium Diamond||Copper Diamond||Silver Diamound|
|Thermal Conductivity (W/mK)||400 - 580||330 - 620||400 - 550|
|Coefficient of Thermal Expansion (CTE)||9-14||7,2 - 12||8 - 12|
|Density (g/cm³)||2.8 - 3.0||5.5 - 6.5||6.0 - 7.0|