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DCB Substrate - Hubert Heusner - Metal Matrix Composites
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Metal Matrix Composites

Metal-Diamond composites such as aluminium-diamond, copper-diamond or silver-diamond are composite materials which allow to combine a high thermal conductivity (range from 300 to 650 W/mK) with a tailored (significantly reduced) coefficient of thermal expansion (between 6 to 12 ppm/K). These materials are of interest for applications as heat sinks, heat spreaders, heat slugs or base plates to provide a reliable and sufficient cooling.

We offers Metal-Diamond composites with properties tailored in a certain range. Aluminium-Diamond, Copper-Diamond and Silver-Diamond MMCs.
Metal-Diamond plates can be produced in various size between 10mm x 10mm to 150mm x 150mm with thickness typically ranging from 2 – 20 mm. Due to the use of sandwich technology Hot Pressing technology is able to provide plates with a high surface quality.

By using hot pressing technology to prepare these type of materials, it is possible to realize sandwich structures or even parts with a certain complexity. Examples for applications of this type of materials are given in several areas of micro, power- or optoelectronic devices such as: Heat spreaders or lids for CPUs in high performance computing or server applications; Cooling plates for LED or laser diodes; Base plate for high power module (IGBT)

DiaCool - Metal-Diamond Composites is a high Performance Materials for ElectronicCooling


  • The combination of a metallic matrix (e.g. Cu, Ag or Al) with a high thermal conductivity in combination with a reinforcement such as diamond with low Coefficient of Thermal Expansion (CTE) results in a material with tailorable thermal properties by sinple variation of the volume content of diamond particles or the approch for the manufacturing of the composite materials, the diamond volume content can be varied between 10 and 60 vol.%
Typical Applications:

Metal - Diamond Composites combine a high thermal conductivity with a low Coefficient of Thermal Expansion (CTE). Such materials are of interest for applications in electronic industry as:
  • Heat Sink ar Heat Spreader in CPU´s
  • Base plates in Power Electronics (e.g. IGBT base plates)
  • Heat Spreaders for LED and HB-LED´s
  • Heat Sink for RF packages
  • Heat Sink for microelectronic packages
  • Thermal management of high thermal loaded electronic compoments

Properties of Metal - Diamond Composites:

Due to te used manufactoring route it is possible to vary the thermophysical properties in a certain range. Depending on composition and the manufactoring conditions

  • The thermal conductivity can be varied between 300 to 650 W/mK
  • The coefficent of thermal expansion can be varied between 8 ppm/K to 14 ppm/K
  • The density of the material is in range of 5.5 to 8 g/cm³ for Cu and 3 g/cm³ for Al composites
  • NiAi finish oder others possible
Range of properties Aluminium Diamond Copper Diamond Silver Diamound
Thermal Conductivity (W/mK) 400 - 580 330 - 620 400 - 550
Coefficient of Thermal Expansion (CTE) 9-14 7,2 - 12 8 - 12
Density (g/cm³) 2.8 - 3.0 5.5 - 6.5 6.0 - 7.0

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