PCB and DBC Surface Finish

We coat our PCB and DCB Substrates as your application need.

Overview Metallization:

Electroless nickel / palladium / gold (Sudpalladium, ENIPIG)
Electroless nickel / gold (immersion gold, ENIG)
Immersion tin
Immersion silver
OSP /Glicoat-SMDF2 (LX)
Galvanic nickel / gold (hard gold)

This coatings are suitable for solderable surfaces, Aluminium wire bonding, Gold wire bonding and pluggable surfaces.

Please send us the specification and all specified dimensions as an pdf-file first. Your will recieve our quotation fast. Use our reliabability and flexibility for your suggess. We take care of your urgent orders also.

Electroless nickel / palladium / gold (Sudpalladium, ENIPIG) Application: Gold (Au) and Aluminium (Al) wire bonding and soldering Process: Nickel/Palladium/Gold Panel size max: 630 mm x650 mm Panel thickness: 0,5 mm bis 4,5 mm Nickel layer thickness: Ni 4 µm - 8 µm Palladium thickness: Pd 0,01 µm - 0,04 µm Sud Gold thickness: Sud-Au 0,03 µ - 0,08 µm
Electroless nickel / gold (immersion gold, ENIG) Application: Aluminium (Al) Wire bonding and soldering Process: Electroless nickel / gold (immersion Gold) Panel Size: 630 mm x 550 mm Panel thickness: 0,5 mm - 4,5 mm Nickel layer thickness: Ni 4 µm - 8 µm Immersion gold layer thickness: 0,05 µm - 0,1 µm
Immersion tin Outstanding soldering, refreshable Process: Chemical Tin (Sn) Panel size max: 630 mm, min size 100 mm x 60 mm Panel thickness: 0,1 mm - 4,0 mm Tin layer thickness: Sn 1 µm - 1,2 µm
Immersion silver Outstanding solderable, refreshable Process: Chemical Silver (Ag) Panel size max: 630 mm breit, min. size 100 mm x 60 mm Panel thickness: 0,1 mm - 4,0 mm Silver (Ag) thickness 0,15 µm - 0,45 µm
OSP / Glicoat-SMDF2 (LX) Low cost coating, Refreshable Process: OSP / Glicoat-SMDF2 (LX) Panel size max: 630 mm, min. size100 mm x 60 mm Dicke: 0,1 mm - 5,0 mm OSP layer thickness: 0,15 µm - 0,3 µm
Electroplating nickel / gold (hard gold) Optimum hardness for connerctors (cobalt allyed), plug contacts Decorative coating Process: Electroplated nickel / Gold (Hard gold) Cobald legiert Panel size max: 610 mm - 550 mm Panel thickness: 0,5 mm - 3,0 mm Layer thickness: Ni > 5 µm / Hard gold thickness 0,2 µm - 2 µm