Backing Plate & Bonding Plates
Backing plate and bonding service become important for evaluating a capable sputtering target supplier and is helpful for the customer to get the finished target that can directly used for coating. We has been dedicated to machining standard backing plate and working together with a special bonding company for providing bonding service.
Backsde Metallization We sputter deposits backside metallization layers like Ag, Ni, Al on the target before bonding. This metallization accomplishes the characteristics:
Bonding & Assurance To improve thermal conductivity under high power inputs, our supplier offers target bonding on backing plates using either Aluminium, Indium and silver based metallic alloy. Durable target bonding requires a varity of pre and post bond functions to assure adhesion. Our quality bonding techniques and process are characterized as following:
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