LOW COST AgENIG Thick Film Substrates are cost effective, relaible, RoHS compliant ceramic substrates with AgENIG metallization without costly platinum/palladium materials.
These versatile, high performance metallized ceramic substrates are an economic substitute for currently used expensive thick film materials containing platinium(palladium and are RoHS compliant. AgENIG (silver with ENIG finish) lower cost metallized ceramic substrates combine silver thick film processing with ENIG (electroless nickel and immersion gold plating). There are 30% lower in price than commonly used Pd-Pt-Ag substrates.
Plated substrates assure more reliable solder connections and can withstand multiple SMT reflow solder cycles and repairs. The tracks resistivity is improved up tenfold to 1 mΩ/square and the substrates can be used up to 170°C continuous operation temperature. Pattern definition can be held to 150 µm line and space.
A combination of various thick film metals and selective gold plating techniques result in achieving various types of surface finish suitable for different assemply types. Therefore the same metallized ceramic substrate yield 0,05 µm gold finish for SMT soldering and welding, 0,76 µm for Gold wire bonding and 2,74 µm of gold for brazing and eutectic die attach.
Multilayers, intergrated resistors, plugged via holes and plated thru holes are also available with the AgENIG products.