Hubert Heusner, Distributor of DCB Substrate
We help our customers to reduce the development time with our short response time and delivery time. Certainly we deliver our products in small quantities and in lot size ONE.
Send us your sketch, we will let you know if we can produce and what the budget price is. Also we will inform you which kind of parameter would help to reduce the costs for samples and increase your profit on series products.
Beside the metalized ceramics we deliver sputter targets on demand. Let us know the specific composition we send you a quote quickly.
Your sputter targets will be processed with our hot pressing system with compacting temperatures up to 2400°C for metals, ceramics and composite material. Our technologies result in very fine-grained microstructures.
For tempering, alloying and soldering is our vacuum-soldering-system the best choice for you. This very compact system gives you all parameter you need. Extremely fast heating and cooling rates results in outstanding soldering results.
DCB substrates (Direct Copper Bond) or DBC substrates (Direct Bond Copper) or CPC substrates (Copper Plated Ceramic), thin-film circuits, thick film circuits and PCTF (Plated Copper on Thick Film) substrates are in the power electronics, LED technology (LED submount) and laser diode technology (laser diode submount) due to the small size, mechanical strength and good thermal conductivity, used more frequently.
In automotive electronics, especially for hybrid cars, wind power technology, DC converters, HF radio technology ceramic substrates are used increasingly. The requirements for high performance electronic are growing.
We supply ceramic substrates for ceramic circuit boards, thick-film circuits, DCB substrates (Direct Copper Bond), DBC substrates (Direct Bond Copper) and thick film hybrids, Rogers PCB and composite substrates in the lot size ONE, small and medium quantities.
An outstanding heat transfer can reached if you solder or glue your circuits on our MMC, (Metal Matrix Composit) like metal-diamond composites. With this high performance material for electroncs cooling you can get much higher performance.
We can provide substrates with 4 different metallization technologies PCTF (Plated Copper on Thick Film), DCB substrates, Thick-Film-substrates, Thin-Film-substrates and Ag-ENIG Substrates. The finish metalisation is up to your application and the follow-up process.
Finish of NiAu (Nickel / Gold) for soldering, glue and Al-Wire bonding (Aluminium-Wire), Finish of NiPdAu (Nickel / Paldium / Gold) for soldering, glue and Al-Wire and Au-Wire bonding. We can process an Ag (Silver) finish also.